九游会J9·(china)官方网站-真人游戏第一品牌

C&D Website Cluster

C&D Website Cluster

【Supply Chain Operation】

C&D Inc.
Iron & Steel Group
Paper & Pulp Group
Automobile Group
Xiamen C&D Light Industry Co., Ltd.
Xiamen Kindland Co., Ltd.
Xiamen C&D Enterprise Co., Ltd.
Xiamen Candour Co., Ltd.
C&D Logistics Group Co., Ltd.
Xiamen C&D Shipbuilding and Trading Co., Ltd.
Xiamen Goldenstar Financial Leasing Co., Ltd.

【Urban Construction and Operation】

C&D Real Estate Group
Lianfa Group
C&D Urban Service

【Tourism and Exhibition】

Tourism Group
C&D Hotel
C&D ITS
Xiamen C& E Group Inc.

【Medical and Health】

C&D Innostic Medical
Xiamen Humanity Hospital
Xiamen Humanity Rehabilitation Hospital
Xiamen Humanity Nursing Home

【Emerging Industry Investment】

C&D Emerging Industry Equity Investment

【Enterprises with Investment and Equity Participation】

King Dragon Life Insurance
Xiamen Airlines
Xiamen Farah Electronics
Xiamen International Bank
Xiamen International Trust
Xiamen Rural Commercial Bank

C&D Website Cluster
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C&D Emerging Industry Equity Investment Successfully Issues Technology Innovation Corporate Bonds

2023/11/24

On November 23, C&D Emerging Industry Equity Investment successfully issued its 2023 technology innovation corporate bonds (first issue) to professional investors. This issuance marks the first public debut of C&D Emerging Industry Equity Investment on the exchange market and is also the first publicly issued technology innovation corporate bond by a science and technology investment entity in Fujian Province. To date, C&D Emerging Industry Equity Investment remains the only private fund manager in Fujian Province to issue innovation bonds, tech innovation bonds, and tech innovation notes, playing a significant role in the sound development of private funds in the province.

It is noted that the bonds are divided into two types: Type A with a term of 2+1 years, a final issuance scale of 700 million yuan, and a coupon rate of 3.37%; Type B with a term of 3+2 years, a final issuance scale of 500 million yuan, and a coupon rate of 3.65%. The funds raised from this bond issuance will be fully utilized to support the development in the field of technological innovation, actively promoting the optimization and strengthening of strategic emerging industries such as advanced manufacturing, biomedicine, new materials, and electronic information.

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